A-Z-Index
Honda, Hiroshi
Institute of Advanced Material Study, Kyushu University, Kasuga, Fukuoka 816-8580, Japan
Condensation
Articles:
FLOW AND HEAT TRANSFER CHARACTERISTICS OF A NATURAL CIRCULATION LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS(open in a new tab) - Vol. 0 '2003(open in a new tab) - Compact Heat Exchangers and Enhancement Technology for the Process Industries - 2003(open in a new tab)
HEAT TRANSFER AND LIQUID SOLID CONTACT DURING THE RAPID QUENCHING OF THIN WIRES IN WATER AND CaCI2/ WATER SOLUTION(open in a new tab) - Vol. 12 '1994(open in a new tab) - International Heat Transfer Conference 10(open in a new tab)
Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72(open in a new tab) - Vol. 46 '2002(open in a new tab) - International Heat Transfer Conference 12(open in a new tab)
EFFECT OF THE DIRECTION OF ON-COMING VAPOR ON LAMINAR FILMWISE CONDENSATION ON A HORIZONTAL CYLINDER (open in a new tab) - Vol. 5 '1974(open in a new tab) - International Heat Transfer Conference 5(open in a new tab)
LAMINAR FILMWISE CONDENSATION ON A VERTICAL SINGLE FLUTED PLATE(open in a new tab) - Vol. 2 '1978(open in a new tab) - International Heat Transfer Conference 6(open in a new tab)
EXPERIMENTAL STUDY OF THE ENHANCEMENT OF CONDENSATION HEAT TRANSFER ON DOWNWARD-FACING HORIZONTAL SURFACES(open in a new tab) - Vol. 3 '1990(open in a new tab) - International Heat Transfer Conference 9(open in a new tab)
Condensation of CFC-11 and HCFC-123 in In-Line Bundles of Horizontal Finned Tubes: Effect of Fin Geometry(open in a new tab) - Vol. 1 '1994(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Enhanced Boiling Heat Transfer from Silicon Chips with Micro-Pin Fins Immersed in FC-72(open in a new tab) - Vol. 10 '2003(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Effect of a Circumferential Rib on Film Condensation on a Horizontal Two-Dimensional Fin Tube(open in a new tab) - Vol. 2 '1995(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Effect of Fin Geometry on the Condensation Heat Transfer Performance of a Bundle Horizontal Low-Finned Tubes(open in a new tab) - Vol. 2 '1995(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
BOILING HEAT TRANSFER FROM A SILICON CHIP IMMERSED IN DEGASSED AND GAS-DISSOLVED FC-72: EFFECTED BY SIZE AND NUMBER DENSITY OF MICRO-REENTRANT CAVITIES(open in a new tab) - Vol. 24 '2017(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72(open in a new tab) - Vol. 6 '1999(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Effects of Tube Diameter and Tubeside Fin Geometry on the Heat Transfer Performance of Air-Cooled Condensers(open in a new tab) - Vol. 8 '2001(open in a new tab) - Journal of Enhanced Heat Transfer(open in a new tab)
Kobayashi, T.
EXPERIMENTAL STUDY OF THE ENHANCEMENT OF CONDENSATION HEAT TRANSFER ON DOWNWARD-FACING HORIZONTAL SURFACES
Kim, Kyoohee
Condensation of CFC-11 and HCFC-123 in In-Line Bundles of Horizontal Finned Tubes: Effect of Fin Geometry
Effect of Fin Geometry on the Condensation Heat Transfer Performance of a Bundle Horizontal Low-Finned Tubes
Fujii, T.
LAMINAR FILMWISE CONDENSATION ON A VERTICAL SINGLE FLUTED PLATE
Takamatsu, Hiroshi
HEAT TRANSFER AND LIQUID SOLID CONTACT DURING THE RAPID QUENCHING OF THIN WIRES IN WATER AND CaCI2/ WATER SOLUTION
Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72
BOILING HEAT TRANSFER FROM A SILICON CHIP IMMERSED IN DEGASSED AND GAS-DISSOLVED FC-72: EFFECTED BY SIZE AND NUMBER DENSITY OF MICRO-REENTRANT CAVITIES
Enhanced Boiling Heat Transfer from Silicon Chips with Micro-Pin Fins Immersed in FC-72
Condensation of CFC-11 and HCFC-123 in In-Line Bundles of Horizontal Finned Tubes: Effect of Fin Geometry
Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72
Wang, Hua Sheng
Effects of Tube Diameter and Tubeside Fin Geometry on the Heat Transfer Performance of Air-Cooled Condensers
Wei, Jin Jia
FLOW AND HEAT TRANSFER CHARACTERISTICS OF A NATURAL CIRCULATION LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS
Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72
Enhanced Boiling Heat Transfer from Silicon Chips with Micro-Pin Fins Immersed in FC-72
Kubo, H.
BOILING HEAT TRANSFER FROM A SILICON CHIP IMMERSED IN DEGASSED AND GAS-DISSOLVED FC-72: EFFECTED BY SIZE AND NUMBER DENSITY OF MICRO-REENTRANT CAVITIES
Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72
Nozu, Sh.
EXPERIMENTAL STUDY OF THE ENHANCEMENT OF CONDENSATION HEAT TRANSFER ON DOWNWARD-FACING HORIZONTAL SURFACES
Fujii, Tetsu
EFFECT OF THE DIRECTION OF ON-COMING VAPOR ON LAMINAR FILMWISE CONDENSATION ON A HORIZONTAL CYLINDER
Fukumori , H.
EXPERIMENTAL STUDY OF THE ENHANCEMENT OF CONDENSATION HEAT TRANSFER ON DOWNWARD-FACING HORIZONTAL SURFACES
Makishi, Osamu
Effect of a Circumferential Rib on Film Condensation on a Horizontal Two-Dimensional Fin Tube
Uchima, B.
EXPERIMENTAL STUDY OF THE ENHANCEMENT OF CONDENSATION HEAT TRANSFER ON DOWNWARD-FACING HORIZONTAL SURFACES
Yamashiro, H.
HEAT TRANSFER AND LIQUID SOLID CONTACT DURING THE RAPID QUENCHING OF THIN WIRES IN WATER AND CaCI2/ WATER SOLUTION